research area: Building & living
project status: ongoing
HyPELignum
The European project „HyPELignum“ under the coordination of RISE (SWE) focusses on the development of printed electronics on wood and wood-based materials. Use-cases considered involve the replacement of fibre reinforced epoxy-based material of common printed circuit boards (PCBs) by wood-based alternatives. Aside from PCBs, additional functionality such as sensors will be integrated into furniture. Furthermore, novel sensors will be used inside timber construction products. The project is also exploring an innovative wood preservation concept, that can be activated on the push of a button only when needed. An essential part of the project is the recycling of the developed products.
This project has received funding from the European Union's Horizon Europe research and innovation program under grant agreement No 101070302 and from the Swiss State Secretariat for Education, Research and Innovation (SERI).
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